Company

        Incorporated in the year 2007 with its sales & marketing wings at USA, is engaged in developing disruptive technologies in microelectronics and microfluidics space. Owns 8 powerful patents in semiconductor & microfluidics technologies and is looking forward to revolutionize the device design & fabrication processes in both semiconducor and glass microfluidic spaces.   

MCL provides Patented                             DISRUPTIVE TECHNOLOGIES for                                 Next Generation Semiconductor Packageless Device design & fabrication                                                 Low Cost Glass Interposers for 3D semicon stack package modules                                                      Ultimate Cost Effective MEMS fabrication &              packaging                                                                 Very Low Cost Glass Microfluidic Devices for Lab On Chip applications & diagnostics.                                Potential replacement for Silicon ink jet module with Low cost Glass ink Jet module

Technology Introduction

Wafer Level Integration Modules Semiconductor MEMS device packaging is more expensive than device fabrication and can lead to total disaster if packaging process runs into problems. All becuase packaging process uses expensive fabricated device either in single die or complete wafer level.         Visit our patented technology page for problem solving.

Low cost 3D stack interposers Silicon interposers in 3D stack package are expensive. Silicon substrates need to be insulated before metal connectors are fabricated.                                Visit our patented technology page for low cost interposers.

Microfluidic Lab On Chip devices Critical diseases detection at clinical labs today is time consuming and expensive.        Time is of essence when it comes to error free detection of any disease and prescription of right medication.                                     Lab On Chip devices that are available today can detect critical diseases in short time. LOC’s are one time use and throw devices and hence are very expensive today, due to their manufacturing process.                                         MCL’s patented microfluidic     embossing & etching (MEE) process offers affordable low cost lab on chips for every one when produced in mass production. 

Visit our patented technology page for learning more about our process & cost.